GE
IS200DAMEG1ADB
$6000
In Stock
T/T
Xiamen
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The IS200DAMEG1ADB is a gate drive interface board belonging to the Innovation Series™ 200DAM_G family from GE Industrial Systems. It is specifically designed as a DAME variant for low voltage drives with a 65 frame power rating. The DAME board provides a non‑amplifying interface between the control rack’s IS200BPIA Bridge Personality Interface (BPIA) board and the IGBT (Insulated Gate Bipolar Transistor) power module. Unlike the DAMA, DAMB, and DAMC boards that amplify gate drive signals, the IS200DAMEG1ADB is a passive interface board without any internal amplification and has no separate power input.
The IS200DAMEG1ADB is unique among the DAM family because it is used in drives where a single IGBT module (model CM100TF‑28H) contains all six IGBTs required for the entire three‑phase power bridge. Therefore, only one DAME board is needed per drive, not three. The board is soldered directly to the IGBT module, meaning that the board and the IGBT module form an inseparable unit; when either fails, both must be replaced together.
The board routes gate control signals from the BPIA to the IGBT gates, and also provides connections for shunt cables and flex circuits used in the drive’s power structure. It contains no fuses, test points, or user‑configurable items. Its compact design and direct integration with the IGBT module make it a highly reliable component for low‑power variable frequency drives.
The IS200DAMEG1ADB acts as a passive signal interface between the BPIA control board and the CM100TF‑28H IGBT module. The BPIA generates low‑power gate drive signals (typically +15 V / -7.5 V logic levels) for the six IGBTs (three upper and three lower devices) that form the three‑phase bridge. These signals are carried via cables to three connectors on the DAME board: APL, BPL, and CPL – one for each phase. The board then routes the signals directly to the appropriate gate terminals of the IGBT module without any amplification or conditioning.
Because the board does not amplify the gate signals, it requires no external power supply. Its primary functions are:
Signal distribution – Receiving gate commands for phases A, B, and C from the BPIA and delivering them to the correct IGBT gates within the single power module.
Mechanical and electrical interface – The board is soldered to the IGBT module’s substrate, providing a low‑inductance path for gate signals. It also provides stud terminals for attaching shunt cables and flex circuits that carry motor output current and feedback signals.
Passive reliability – With no active components, the board’s failure rate is extremely low.
A block diagram of the DAME board’s operation is shown in Figure 3 of the attached document. The board connects to the BPIA via three cables (APL, BPL, CPL). It also interfaces with the drive’s power structure via stud terminals for shunt cables and flex circuits.
The IS200DAMEG1ADB is a small printed wiring board that is soldered directly to the CM100TF‑28H IGBT module. The combined assembly (IGBT module with DAME board) mounts onto the drive’s heatsink using four Allen‑head bolts. The board includes multiple stud terminals (seven studs) that accept shunt cables and flex circuits. Because the board is soldered, it is not field‑replaceable as a separate item; replacement always requires exchanging the entire IGBT‑DAME assembly.
The board provides the following interface points:
Connector / Terminal | Type | Description |
|---|---|---|
APL | Cable connector (on board) | Receives gate drive signals for phase A from the BPIA board. |
BPL | Cable connector (on board) | Receives gate drive signals for phase B from the BPIA board. |
CPL | Cable connector (on board) | Receives gate drive signals for phase C from the BPIA board. |
Shunt cable studs (3) | Stud terminals with nuts, washers, spring lock washers | Secure the three shunt cables that carry DC bus current measurements. |
Outer flex circuit studs (2) | Stud terminals | Connect to the outer flex circuit that routes motor output current. |
Inner flex circuit studs (2) | Stud terminals | Connect to the inner flex circuit for additional power routing. |
IGBT terminals (internal) | Soldered connections | Direct connection to the IGBT gates, emitters, and collectors within the module. |
The attached document does not provide a dedicated LED table for the DAME board. Based on typical design practice, the DAME board may include status LEDs for each phase (e.g., A, B, C) to indicate that gate drive signals are being received. However, the attached document does not specify these. Therefore, the IS200DAMEG1ADB is assumed to have no onboard LEDs or the LEDs are not documented. In either case, diagnostics rely on the BPIA and drive control system rather than on‑board visual indicators.
The IS200DAMEG1ADB is intended exclusively for GE Innovation Series low voltage drives that use a 65 frame power structure with the CM100TF‑28H IGBT module. Typical applications include:
Small industrial motor drives (up to approximately 5–15 HP / 4–11 kW depending on voltage)
Compact HVAC drives
Conveyor and pump drives in light industrial environments
Fan and blower controls
Small machine tool spindles
Because a single DAME board serves all three phases, the drive’s power stack is extremely compact. The board receives three separate gate signal cables (APL, BPL, CPL) from the BPIA, each carrying PWM signals for one phase’s upper and lower IGBTs. The board then routes these signals directly to the appropriate gate terminals inside the CM100TF‑28H module.
Hazardous voltages are present on the IGBT module, heatsink, and connected circuits when the drive is energized. Always de‑energize the drive and verify zero voltage using appropriate high‑voltage testing equipment before touching any board or circuit.
Static sensitivity – The IS200DAMEG1ADB contains static‑sensitive components (the IGBT module is also static‑sensitive). Handle the assembly only at a grounded workstation while wearing a wrist grounding strap. Store the assembly in an antistatic bag.
Do not remove, insert, or adjust connections while power is applied – This may cause equipment damage or electric shock.
Critical note – The DAME board is soldered to the IGBT module. Replacement of the board alone is impossible. When the board fails, the entire IGBT‑DAME assembly must be replaced. Conversely, if the IGBT module fails, the attached DAME board (unless proven good) should also be replaced as a unit.
De‑energize the drive and open the cabinet door. Verify zero voltage on all electrical circuits.
Locate the heatpipe heat exchanger assembly and the IGBT module (with the DAME board mounted on top) directly below.
Disconnect the cables from connectors APL, BPL, and CPL on the IS200DAMEG1ADB board. Secure the cables out of the way.
Remove the three nuts, washers, and spring lock washers that secure the three shunt cables to the IGBT studs. Relocate the three cables so they do not interfere with removal.
Remove the two nuts, washers, and spring lock washers that secure the outer flex circuit to the IGBT studs. Relocate the flex circuit.
Remove the two nuts, washers, and spring lock washers that secure the inner flex circuit to the IGBT studs. Relocate the flex circuit.
Remove the four Allen‑head bolts and washers that secure the IGBT module to the heatsink. Carefully lift the IGBT module with the DAME board attached.
Remove the seven studs, washers, and spring lock washers from the IGBT module (the studs to which the shunt cables and flex circuits were fastened). Keep these hardware items for reuse.
Insert and fully tighten the seven studs, washers, and spring lock washers into the new IGBT module that comes with the IS200DAMEG1ADB board already soldered. Place the studs in the same respective positions from which they were removed.
Mount the new IGBT module with DAME board to the heatsink as follows:
a. Spread an even film of Dow Corning 340 silicon grease (or equivalent) onto the back mounting surface of the IGBT module. The film must be at least 6 mils (0.15 mm) thick.
b. Orient and position the IGBT module with the DAME board in the same position as the one removed. Insert the four Allen‑head bolts and washers into the mounting holes.
c. Snug up the four bolts in a diagonally crossing pattern (top left, lower right, top right, lower left).
d. Tighten the four bolts in a diagonally crossing pattern (reversed from the previous step) to 40 inch‑pounds torque.
Reposition the inner flex circuit onto the mounting studs and secure with two nuts, washers, and spring lock washers.
Reposition the outer flex circuit onto the mounting studs and secure with two nuts, washers, and spring lock washers.
Reinstall the three shunt cables assembly to the IGBT module studs with three nuts, washers, and spring lock washers (removed earlier).
Reconnect the respective cables to connectors APL, BPL, and CPL on the new IS200DAMEG1ADB board. Ensure each cable is seated correctly.
Visually inspect all connections, buses, and bolted hardware for correct installation.
Check the drive cabinet for any tools, debris, or loose hardware.
Close the drive cabinet door and restore power.
To order a replacement IS200DAMEG1ADB (which will come as a complete assembly with the CM100TF‑28H IGBT module), use the full part number exactly as shown. The part number follows GE’s convention:
IS200 – Innovation Series, 200V class
DAM – Functional acronym: Gate Drive Amplifier/Interface board
E – Variant: DAME (65 frame)
G1 – Generation 1
A – Additional modifier (e.g., coating or feature)
D – Another modifier
B – Revision B
Warranty replacements (within warranty period): Contact GE Industrial Control Systems Product Service Engineering directly:
GE Industrial Control Systems
Product Service Engineering
1501 Roanoke Blvd.
Salem, VA 24153‑6492 USA
Phone: +1‑540‑387‑7595
Fax: +1‑540‑387‑8606
Spare parts or non‑warranty orders: Contact your nearest GE Sales or Service Office. Provide:
Complete part number: IS200DAMEG1ADB
Drive serial number
Note: All digits in the part number are important. GE may substitute later compatible revisions, but backward compatibility is assured. Because the DAME board is soldered to the IGBT module, the factory will supply the combined unit.
Antistatic protection – Always store the IS200DAMEG1ADB (as part of the IGBT assembly) in an antistatic bag or box. Use a grounded wrist strap when handling.
Avoid mechanical stress – Do not bend, flex, or drop the assembly. Handle by the edges of the IGBT module, not by the DAME board.
Moisture – Keep the assembly dry. If condensation is possible, allow it to acclimate before installation.
Shipping – Use original GE packaging or an equivalent antistatic, cushioned container.
Because the DAME board has no on‑board LEDs or diagnostic features, troubleshooting the IS200DAMEG1ADB requires checking the overall drive system:
Symptom | Possible Cause | Recommended Action |
|---|---|---|
Drive fails to run; gate drive fault indicated by BPIA | One or more gate signals not reaching IGBT; broken cable, poor connection, or damaged DAME board | Check cables at APL, BPL, CPL for continuity. Reseat connectors. If problem persists, replace IGBT‑DAME assembly. |
Short circuit or overcurrent fault | IGBT module failed; DAME board may also be damaged | Replace entire IGBT‑DAME assembly. Inspect gate drive cables. |
No gate signals on all phases | BPIA board fault or missing power supply | Check BPIA board and its power supply. Verify that the BPIA is sending gate commands. |
Intermittent operation | Loose connections at stud terminals (shunt cables or flex circuits) | Tighten nuts and spring lock washers. Inspect for corrosion or arcing. |
If the DAME board is suspected of failure (e.g., open circuit in gate trace), there is no field repair; the entire IGBT‑DAME assembly must be replaced.
The IS200DAMEG1ADB is specifically designed for drives using the CM100TF‑28H IGBT module in a 65 frame configuration. It is not interchangeable with DAMA (620 frame), DAMB (375 frame), DAMC (250 frame), or DAMD (180/125/92 frame) boards. The DAME board is unique in that one board serves all three phases, whereas other DAM variants require three boards per drive.
Typical compatible GE drive models include certain Innovation Series LV5 drives and small AF‑600FP drives with a 65 frame power stack. Consult the drive’s bill of materials or contact GE support for exact compatibility.
The IS200DAMEG1ADB, being a passive soldered‑on board with no moving parts, requires no routine maintenance. However, because it is thermally and electrically coupled to the IGBT module, its lifetime is essentially that of the IGBT module. In case of IGBT failure (due to overcurrent, overvoltage, or aging), the DAME board may also be damaged by the fault. Therefore, GE recommends replacing the DAME board together with the IGBT module. Periodic visual inspection for cracked solder joints, discoloration, or damage is advised during drive servicing.
Specification Category | Details |
|---|---|
Model Number | IS200DAMEG1ADB |
Product Series | Innovation Series™ 200DAM_G |
Board Variant | DAME (65 frame) |
Frame Size | 65 frame |
Compatible IGBT Module | CM100TF‑28H (single module containing 6 IGBTs – all three phases) |
Number of Boards per Drive | 1 (covers all three phases) |
IGBTs per Phase Leg | Not applicable – one module contains IGBTs for all three phases |
Primary Function | Passive interface between BPIA control board and the IGBT module; no amplification |
Input Power Supply | None (board is passive; gate signals come from BPIA) |
Control Interface | Connects to IS200BPIA Bridge Personality Interface board via three cables (APL, BPL, CPL) |
Output | Routes gate signals to the six IGBTs within the CM100TF‑28H module |
Built‑in Features | No fuses, no test points, no user‑configurable items; board soldered to IGBT module |
LED Indicators | Not documented (likely none) |
Connector Types | Three cable receptacles (APL, BPL, CPL) for gate signals; stud terminals for shunt cables and flex circuits |
Number of Stud Terminals | 7 studs (3 for shunt cables, 2 for outer flex circuit, 2 for inner flex circuit) |
Cooling | Passive; relies on drive’s heatsink (the IGBT module is mounted with thermal grease) |
Electrical Isolation | Provided via optocouplers on the BPIA board (not on DAME) |
Operating Temperature | 0°C to 50°C (typical for drive internal environment; refer to drive manual) |
Storage Temperature | -40°C to +85°C |
Humidity | 5% to 95% non‑condensing |
Mounting Method | Soldered to IGBT module; the combined assembly mounts to heatsink using four Allen‑head bolts |
Torque Requirements for IGBT Mounting | 40 inch‑pounds (for the four Allen‑head bolts, tightened in a diagonal pattern) |
Thermal Interface Material | Dow Corning 340 silicon grease (or equivalent), minimum 6 mils (0.15 mm) thick |
Shunt Cable and Flex Circuit Nuts | Tighten securely (torque not specified; use standard practice for M4 or M5 hardware) |
Regulatory Compliance | Designed to meet GE Industrial Systems standards; CE marked as part of complete drive |
Warranty | Covered under GE standard product warranty (refer to GE Terms and Conditions) |
RoHS Status | Compliant per GE policy (verify with factory for specific revision) |
Replaceability | Not field‑replaceable separately; must be replaced together with the CM100TF‑28H IGBT module |